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List of Qualcomm Snapdragon systems on chips

Smartphone electronics product line

Wikipedia contributorsAdapted for Fathomly · View authors
68 min read
Source updated September 11, 2026
Image credit is listed at the end of this article.

The Snapdragon is a brand of systems on chips (SoCs) designed by Qualcomm and intended for mobile computing use.

01Acronyms

System on chips released before the Snapdragon naming scheme are referred to only by their stock keeping unit (SKU) numbers. Some models were later given a Snapdragon product name. Earlier models are prefixed by an acronymic three-letter code; their full forms are as follows:

  • QSC (Qualcomm Single Chip)
  • MSM (Mobile Station Modem), denotes a chip with integrated cellular modem
  • APQ (Application Processor Qualcomm), denotes a chip without modem
Model number Fab CPU GPU (or Gfx Core) Modem Sampling availability
QSC1xxx
QSC1100 65 nm ARM926EJ-S @ 96/128 MHz No 3D, ARM 2D CDMA2000 1x Q4 2007
QSC1110
QSC1105 ARM926EJ-S @ 211/316 MHz CDMA2000 1x, GSM

(Dual-Standby)

 2010
QSC1215 Q3 2012
QSC6xxx
QSC6010 ARM926EJ-S No 3D, ARM 2D CDMA2000 1x 2006
QSC6020
QSC6030
QSC6055 65 nm ARM926EJ-S @ 192 MHz Q1 2007
QSC6065 Q2 2007
QSC6075 ARM926EJ-S @ 192/312 MHz EV-DO Rel.0
QSC6085 EV-DO Rel.0/Rev.A Q4 2007
QSC6155 45 nm ARM1136JF-S @ 480 MHz

with L2 cache

 Stargate 3D, ARM 2D CDMA2000 1x,

GSM, GPRS

 2008
QSC6165
QSC6175 EV-DO Rel.0
QSC6185 EV-DO Rel.0/Rev.A
QSC6195 EV-DO Rel.0/Rev.A/Rev.B
QSC6240
(ESC6240)		 65 nm ARM926EJ-S @ 184/230 MHz No 3D, ARM 2D GSM, GPRS,

EDGE, WCDMA

 Q3 2007
QSC6245-1
QSC6260-1 GSM, GPRS,

EDGE, WCDMA, HSDPA

QSC6270
(ESC6270)
QSC6295
(ESC6295)		 45 nm ARM1136JF-S @ 480 MHz

with L2 cache

 Stargate 3D, ARM 2D GSM, GPRS,

EDGE, WCDMA, HSPA+

 2009
QSC6695 CDMA2000 1x
QSC7230 ARM1136JF-S @ 600 MHz
MSMx
MSM1 800 nm 80186 (x86-16) CDMA IS-95 A

(cdmaOne)

 Q1 1993
MSM2 500 nm 80186 (x86-16) 1995
MSM2xxx
MSM2300 80186 (x86-16) CDMA IS-95 A/B

(cdmaOne)

 Q1 1997
MSM2310 80186 (x86-16) Q2 1998
MSM3xxx
MSM3000 350 nm ARM7TDMI No 3D, ARM 2D CDMA IS-95 A/B

(cdmaOne)

 Q3 1998
MSM3100 Q1 1999
MSM3300 Q1 2000
MSM5xxx
MSM5000 180 nm ARM7TDMI No 3D, ARM 2D CDMA2000 1x Q3 2000
MSM5100 180 nm ARM7TDMI @ 50 MHz CDMA2000 1x,

AMPS

 Q1 2000
MSM5105 180 nm ARM7TDMI @ 27 MHz CDMA2000 1x,

AMPS

 Q3 2001
MSM5200 180 nm ARM7TDMI @ 50 MHz WCDMA Q4 2000
MSM5500 180 nm ARM7TDMI @ 50 MHz CDMA2000 1x,

EV-DO Rel.0

 Q4 2000
MSM6xxx
MSM6000 250 nm ARM7TDMI @ 20 MHz No 3D, ARM 2D CDMA2000 1x Q1 2002
MSM6025 180 nm ARM7TDMI @ 40 MHz Q3 2003
MSM6050 180 nm Q1 2003
MSM6100 90 nm ARM926EJ-S @ 146 MHz ARM-DSP 3D, ARM 2D Q4 2002
MSM6125 90 nm CDMA2000 1x,

GSM, GPRS

 Q4 2005
MSM6150 130 nm ARM926EJ-S @ 225 MHz Defender2 3D, ARM 2D CDMA2000 1x Q3 2004
MSM6175 65 nm ARM926EJ-S @ 270 MHz Defender3 3D, ARM 2D 2006
MSM6200 180 nm ARM7TDMI @ 40 MHz No 3D, ARM 2D GSM, GPRS,

EDGE, WCDMA

 Q3 2002
MSM6225 90 nm ARM926EJ-S @ 146 MHz GSM, GPRS,

EDGE, WCDMA, HSDPA

 Q2 2005
MSM6250 130 nm ARM-DSP 3D, ARM 2D GSM, GPRS,

EDGE, WCDMA

 Q3 2003
MSM6250A 90 nm ARM926EJ-S @ 180 MHz
MSM6245 65 nm ARM926EJ-S @ 225 MHz No 3D, ARM 2D Q2 2006
MSM6246 ARM926EJ-S @ 274 MHz GSM, GPRS,

EDGE, WCDMA, HSDPA
MSM6255A ARM926EJ-S @ 225 MHz GSM, GPRS,

EDGE, WCDMA

 Q2 2006
MSM6260 ARM-DSP 3D, ARM 2D GSM, GPRS,

EDGE, WCDMA, HSDPA
MSM6275 90 nm Defender2 3D, ARM 2D Q4 2004
MSM6280 90 nm ARM926EJ-S @ 274 MHz Q3 2005
MSM6280A Stargate 3D, ARM 2D 2007
MSM6290 65 nm ARM926EJ-S @ 300 MHz GSM, GPRS,

EDGE, WCDMA, HSDPA, HSUPA

 2009
MSM6300 90 nm ARM926EJ-S No 3D, ARM 2D CDMA2000 1x,

GSM, GPRS

 Q3 2002
MSM6500 130 nm ARM926EJ-S @ 146 MHz ARM-DSP 3D, ARM 2D CDMA2000 1x,

EV-DO Rel.0, GSM, GPRS

 2002
MSM6550 ARM926EJ-S @ 225 MHz Defender2 3D, ARM 2D Q3 2004
MSM6550A 90 nm
MSM6575 65 nm ARM926EJ-S @ 270 MHz Defender3 3D, ARM 2D 2006
MSM6800 130 nm CDMA2000 1x,

EV-DO Rel.0/Rev.A, GSM, GPRS

 Q2 2006
MSM6800A 90 nm 2007
MSM7xxx
MSM7200 90 nm ARM1136J-S @ 400 MHz Imageon 2D, 3D
Q3Dimension

(Adreno 130)

 GSM, GPRS,

EDGE, WCDMA, HSDPA, HSUPA

 2006
MSM7200A ARM1136J-S @ 528 MHz Q1 2007
MSM7201 90 nm ARM1136JF-S @ 528 MHz 2008
MSM7201A 65 nm
MSM7500 90 nm ARM1136JF-S @ 528 MHz CDMA2000 1x,

EV-DO Rel.0/Rev.A

 2006
MSM7500A 65 nm Q4 2007
MSM7600 90 nm ARM1136J-S @ 528 MHz GSM, GPRS,

EDGE, WCDMA, HSDPA, HSUPA,
CDMA2000 1x,

EV-DO Rel.0/Rev.A

 Q1 2007
MSM7600A 65 nm
MSM7850 LT 3D, LT 2D CDMA2000 1x,

EV-DO Rel.0/Rev.A/Rev.B

 2008

02Snapdragon S series

Snapdragon S1

Model number Fab CPU (Core/Freq) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7225 65 nm 1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1, no L2 cache Software- rendered 2D support (HVGA) Hexagon QDSP5 320 MHz Up to 5 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s) UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 2007
MSM7625 CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM
MSM7227 1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1, 256K L2 cache Adreno 200 226 MHz (FWVGA) Up to 8 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s) UMTS; GSM Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 2008
MSM7627 CDMA, UMTS; GSM
MSM7225A 45 nm 1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache Adreno 200 245 MHz (HVGA) Hexagon QDSP5 350 MHz Up to 5 MP camera LPDDR Single-channel 200 MHz (1.6 GB/s) UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 Q4 2011
MSM7625A CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A 1 core up to 1.0 GHz Cortex-A5 (ARMv7): 32K+32K L1, 256K L2 cache Adreno 200 245 MHz (FWVGA) Up to 8 MP camera UMTS, MBMS; GSM
MSM7627A CDMA2000, UMTS, MBMS; GSM
MSM7225AB UMTS: up to 7.2 Mbit/s, MBMS; GSM
QSD8250 65 nm 1 core up to 1.0 GHz Scorpion (ARMv7): 32K+32K L1, 256K L2 cache Adreno 200 226 MHz (WXGA) Hexagon QDSP6 600 MHz Up to 12 MP camera LPDDR Single-channel 400 MHz UMTS, MBMS; GSM Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 Q4 2008
QSD8650 CDMA2000, UMTS, MBMS; GSM

Snapdragon S2

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7230 45 nm 1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2 Adreno 205 266 MHz (XGA) Hexagon QDSP5 256 MHz Up to 12 MP camera LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) GSM, GPRS, W-CDMA, UMTS, EDGE, MBMS, HSDPA, HSUPA, HSPA+ Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 Q2 2010
MSM7630 CDMA2000 (1×Adv, 1×EV-DO Rel. 0/Rev. A/Rev. B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055 1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2 , N/a
MSM8255 1 core up to 1.0 GHz Scorpion: 32K+32K L1, 384K L2 UMTS, MBMS; GSM
MSM8655 CDMA2000, UMTS, MBMS; GSM
MSM8255T 1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2 UMTS, MBMS; GSM
MSM8655T CDMA2000, UMTS, MBMS; GSM

Snapdragon S3

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8060 45 nm 2 cores up to 1.7 GHz Scorpion: 512 KB L2 Adreno 220 266 MHz (WXGA+) Hexagon QDSP6 400 MHz Up to 16 MP camera LPDDR2 Single- channel 333 MHz (2.67 GB/s) , N/a Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 2011
MSM8260 GSM, GPRS, W-CDMA, UMTS, HSDPA, HSUPA, HSPA+, EDGE, MBMS Q3 2010
MSM8660 CDMA2000 (1×Adv, 1×EV-DO Rel. 0/Rev. A/Rev. B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM

Snapdragon S4

Snapdragon S4 was offered in three models: S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012. The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro).

Snapdragon S4 Play

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8225 45 nm 2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2 Adreno 203 320 MHz (FWVGA) Hexagon Up to 8 MP camera LPDDR2 Single-channel 300 MHz UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 1H 2012
MSM8625 CDMA (1×Rev. A, 1×EV-DO Rev. A/B); UMTS; GSM

Snapdragon S4 Plus

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8227 28 nm 2 cores up to 1.0 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 320 MHz (FWVGA / 720p) Hexagon QDSP6 Unknown LPDDR2 Single-channel 400 MHz GSM (GPRS, EDGE), UMTS (DC-HSPA+, TD-SCDMA) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen 8A; USB 2.0 2H 2012
MSM8627 CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM
APQ8030 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 400 MHz (qHD / 1080p) Up to 13.5 MP camera LPDDR2 Single-channel 533 MHz , N/a . 3Q 2012
MSM8230 UMTS; GSM .
MSM8630 CDMA, UMTS; GSM
MSM8930 World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA, UMTS; GSM)
APQ8060A 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 225 400 MHz (WUXGA / 1080p) Up to 20 MP camera LPDDR2 Dual-channel 500 MHz , N/a . 2H 2012
MSM8260A UMTS; GSM Q1 2012
MSM8660A CDMA, UMTS; GSM
MSM8960 World Mode (LTE Cat 3)

Snapdragon S4 Pro and S4 Prime (2012)

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8260A Pro 28 nm (TSMC 28LP) 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 320 400 MHz (WUXGA / 1080p) Hexagon QDSP6 Up to 20 MP camera LPDDR2 Dual-channel 500 MHz GSM (GPRS, EDGE), UMTS (DC-HSPA+, TD-SCDMA) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) Q2 2012
MSM8960T Pro (MSM8960AB)
MSM8960DT 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Q3 2013
APQ8064 4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p) LPDDR2 Dual-channel 533 MHz External 2012

03Snapdragon 2 series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 series (2013-2019)

Model number Product name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
MSM8225Q Snapdragon 200 45 nm (TSMC 45LP) 4 cores up to 1.4 GHz Cortex-A5 Adreno 203 400 MHz (12.8 GFLOPS in FP32) Hexagon QDSP5 Up to 8 MP single camera LPDDR2 Single-channel 333 MHz Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 , N/a 2013 2013
MSM8625Q Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210 28 nm (TSMC 28LP) 2 cores up to 1.2 GHz Cortex-A7 Adreno 302 400 MHz (12.8 GFLOPS in FP32) Hexagon QDSP6 Gobi 3G (UMTS; GSM)
MSM8610 Gobi 3G (CDMA/UMTS; GSM)
MSM8212 4 cores up to 1.2 GHz Cortex-A7 Gobi 3G (UMTS; GSM)
MSM8612 Gobi 3G (CDMA/UMTS; GSM)
MSM8905 Qualcomm 205 2 cores up to 1.1 GHz Cortex-A7 Adreno 304 400 MHz (19.2 GFLOPS in FP32) Hexagon 536 Up to 3 MP single camera LPDDR2/3 Single-channel 384 MHz X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) 4.0 March 20, 2017 2017
MSM8208 Snapdragon 208 Up to 5 MP single camera LPDDR2/3 Single-channel 400 MHz Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) 2.0 September 9, 2014 2014
MSM8909 Snapdragon 210 4 cores up to 1.1 GHz Cortex-A7 Up to 8 MP single camera LPDDR2/3 Single-channel 533 MHz X5 LTE
MSM8909AA Snapdragon 212 4 cores up to 1.3 GHz Cortex-A7 July 28, 2015 2015
QM215 Qualcomm 215 4 cores up to 1.3 GHz Cortex-A53 Adreno 308 485 MHz (23.3 GFLOPS in FP32) Hexagon Up to 13 MP single camera / 8 MP dual camera LPDDR3 Single-channel 672 MHz 3 GB X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 1.0 July 9, 2019 Q3 2019

04Snapdragon 4 series

The Snapdragon 4 series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 series, which were aimed at ultra-budget segment. Similar to the 2 series, it is the successor of the S4 Play.

Snapdragon 400 series (2013-2021)

Model number Product name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
APQ8026 Snapdragon 400 28 nm (TSMC 28LP) 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 Adreno 305 400 MHz (19.2 GFLOPS in FP32) Hexagon QDSP6 Up to 13.5 MP single camera LPDDR2/3 Single-channel 533 MHz , N/a Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS 1.0 2013 2013
MSM8226 Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626 Gobi 3G (CDMA/UMTS)
MSM8926 Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 Adreno 305 450 MHz (21.6 GFLOPS in FP32) , N/a
MSM8228 Gobi 3G (UMTS)
MSM8628 Gobi 3G (CDMA/UMTS)
MSM8928 Gobi 4G (LTE Cat 4)
MSM8230 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 Adreno 305 400 MHz (19.2 GFLOPS in FP32) LPDDR2 Single-channel 533 MHz Gobi 3G (UMTS)
MSM8630 Gobi 3G (CDMA/UMTS)
MSM8930 Gobi 4G (LTE Cat 4)
MSM8930AA 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 Gobi 4G (LTE Cat 4)
APQ8030AB 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 Adreno 305 450 MHz (21.6 GFLOPS in FP32) , N/a
MSM8230AB Gobi 3G (UMTS)
MSM8630AB Gobi 3G (CDMA/UMTS)
MSM8930AB Gobi 4G (LTE Cat 4)
APQ8016 Snapdragon 410 28 nm (TSMC 28LP) / 28 nm (SMIC) 4 cores up to 1.2 GHz Cortex-A53 Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32) Hexagon QDSP6 V5 LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) , N/a Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou 2.0 December 9, 2013 H1 2014
MSM8916 X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2 Snapdragon 412 28 nm (TSMC 28LP) 4 cores up to 1.4 GHz Cortex-A53 Adreno 306 450 MHz (21.6 GFLOPS in FP32) LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s) July 28, 2015 H2 2015
MSM8929 Snapdragon 415 4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53) Adreno 405 465 MHz (44.6 GFLOPS in FP32) Hexagon V50 Up to 13 MP single camera LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s) Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS February 18, 2015 H1 2015
MSM8917 Snapdragon 425 4 cores up to 1.4 GHz Cortex-A53 Adreno 308 598 MHz (28.7 GFLOPS in FP32) Hexagon 536 Up to 16 MP single camera X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C February 11, 2016 Q3 2016
MSM8920 Snapdragon 427 X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 October 18, 2016 Q1 2017
MSM8937 Snapdragon 430 4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53) Adreno 505 450 MHz (43.2 GFLOPS in FP32) Up to 21 MP single camera LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) X6 LTE September 15, 2015 Q2 2016
MSM8940 Snapdragon 435 X9 LTE February 11, 2016 Q4 2016
SDM429 Snapdragon 429 12 nm (TSMC 12FFC) 4 cores up to 2.0 GHz Cortex-A53 Adreno 504 320 MHz (30.7 GFLOPS in FP32) Hexagon 536 Up to 16 MP single camera / 8 MP dual camera X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0 June 26, 2018 Q3 2018
SDM439 Snapdragon 439 4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53) Adreno 505 650 MHz (62.4 GFLOPS in FP32) Up to 21 MP single camera / 8 MP dual camera
SDM450 Snapdragon 450 14 nm (Samsung 14LPP) 8 cores up to 1.8 GHz Cortex-A53 Adreno 506 600 MHz (57.6 GFLOPS in FP32) Hexagon 546 Up to 24 MP single camera / 13 MP dual camera LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 June 28, 2017 Q3 2017
SM4250-AA Snapdragon 460 11 nm (Samsung 11LPP) 4 + 4 cores (1.8 GHz Kryo 240 Gold, Cortex-A73 + 1.6 GHz Kryo 240 Silver, Cortex-A53) Adreno 610 600 MHz (153.6 GFLOPS in FP32) Hexagon 683 Spectra 340 (48 MP single camera / 16 MP dual camera) LPDDR3 up to 933 MHz
or
LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)		 X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C January 20, 2020 Q1 2020
SM4350 Snapdragon 480 8 nm (Samsung 8LPP) 2 + 6 cores (2.0 GHz Kryo 460 Gold, Cortex-A76 + 1.8 GHz Kryo 460 Silver, Cortex-A55) Adreno 619 650 MHz (332.8 GFLOPS in FP32) Hexagon 686 (3.3 TOPS) Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C 4+ January 4, 2021 H1 2021
SM4350-AC Snapdragon 480+ 2 + 6 cores (2.2 GHz Kryo 460 Gold, Cortex-A76 + 1.9 GHz Kryo 460 Silver, Cortex-A55) FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C October 26, 2021 Q4 2021

Snapdragon 4 (since 2022)

Model number Product name Fab CPU
(Cores / Freq)		 GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
SM4375 Snapdragon 4 Gen 1 6 nm (TSMC N6) Kryo
2 + 6 cores
(2.0 GHz Cortex-A78
+ 1.8 GHz Cortex-A55)		 Adreno 619 700 MHz (358.4 GFLOPS in FP32) Hexagon Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1 4+ September 6, 2022 Q3 2022
SM4450 Snapdragon 4 Gen 2 4 nm (Samsung 4LPX) Kryo
2 + 6 cores
(2.2 GHz Cortex-A78
+ 1.95 GHz Cortex-A55)		 Adreno 613 955 MHz (244.5 GFLOPS in FP32) , N/a Spectra (108 MP single camera / 16 MP dual camera with ZSL) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 June 26, 2023 Q2 2023
Snapdragon 4 Gen 2 Accelerated Edition Kryo
2 + 6 cores
(2.3 GHz Cortex-A78
+ 1.95 GHz Cortex-A55)		 Adreno 613 1010 MHz (258.6 GFLOPS in FP32) May 17, 2024 Q2 2024
SM4635 Snapdragon 4s Gen 2 Kryo
2 + 6 cores
(2.0 GHz Cortex-A78
+ 1.8 GHz Cortex-A55)		 Adreno 611 Spectra (84 MP single camera / 16 MP dual camera with ZSL) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) Internal (5G NR Sub-6: download up to 1 Gbit/s) July 30, 2024 Q3 2024
SM4450-AF Snapdragon 4 Gen 4 Kryo
2 + 6 cores
(2.3 GHz Cortex-A78
+ 1.95 GHz Cortex-A55)		 Adreno 613 Spectra (108 MP single camera / 16 MP dual camera with ZSL) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) December 12, 2025 Q4 2025
SM4850 Snapdragon 4 Gen 5 Kryo
2 + 6 cores
(2.4 GHz Cortex-A78
+ 2.0 GHz Cortex-A55)		 Adreno 629 840 MHz (430.1 GFLOPS in FP32) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) Internal (5G NR Sub-6: download up to 2.8 Gbit/s, upload up to 900 Mbit/s) Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 2.0 5 May 7, 2026 Q2 2026

05Snapdragon 6 series

The Snapdragon 6 series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon line-up, appearing in mainstream devices of various manufacturers.

Snapdragon 600 series (2013-2023)

Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series became a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.

Model
number		 Product
name		 Fab CPU

(Cores/Freq)

 GPU DSP ISP Memory

technology

 Modem Connectivity Quick
Charge		 Announcement
date		 Sampling
availability
APQ8064-1AA (DEB/FLO) Snapdragon

600
(Advertised as S4 Pro)

 28 nm (TSMC 28LP) 4 cores up to 1.5 GHz
Krait 300		 Adreno 320 400 MHz (76.8 GFLOPS in FP32) Hexagon QDSP6 V4 500 MHz Up to 21 MP single camera; Video Capture: 1080p@30fps DDR3L-1600
(12.8 GB/s)		 External Bluetooth 4.0,
Wi-Fi 802.11ac
(2.4/5 GHz),
IZat Gen8A		 1.0 January 8, 2013 Q1 2013
APQ8064M Snapdragon

600

 4 cores up to 1.7 GHz Krait 300 LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)
APQ8064T Snapdragon

600

 LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)
APQ8064AB Snapdragon

600

 4 cores up to 1.9 GHz Krait 300 Adreno 320 450 MHz (86.4 GFLOPS in FP32)
MSM8936 Snapdragon

610

 4 cores up to 1.7 GHz Cortex-A53 Adreno 405 550 MHz (52.8 GFLOPS in FP32) Hexagon V50 700 MHz LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou 2.0 February 24, 2014 Q3 2014
MSM8939 Snapdragon

615

 4 + 4 cores (1.7 GHz +

 1.1 GHz) Cortex-A53

MSM8939

v2

 Snapdragon

616

 4 + 4 cores (1.7 GHz +

 1.2 GHz) Cortex-A53

 July 31, 2015 Q3 2015
MSM8952 Snapdragon

617

 4 + 4 cores (1.5 GHz +

 1.2 GHz) Cortex-A53

 Hexagon 546 LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C; USB 2.0 3.0 September 15, 2015 Q4 2015
MSM8953 Snapdragon

625

 14 nm (Samsung 14LPP) 8 cores up to 2.0 GHz Cortex-A53 Adreno 506 650 MHz (62.4 GFLOPS in FP32) Up to 24 MP single camera; Video Capture: 4K@30fps X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, NFC, VIVE 1-stream Wi-Fi 802.11ac MU-MIMO, IZat Gen8C; USB 3.0 February 11, 2016 Q2 2016
MSM8953

Pro

 Snapdragon

626

 8 cores up to 2.2 GHz Cortex-A53 October 18, 2016 Q4 2016
SDM630 Snapdragon

630

 4 + 4 cores (2.2 GHz +

 1.8 GHz) Cortex-A53)

 Adreno 508 650 MHz (124.8 GFLOPS in FP32) Hexagon 642 Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps) LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi 1x1, NFC, USB 3.1 4.0 May 8, 2017 Q2 2017
SDM632 Snapdragon

632

 4 + 4 cores (1.8 GHz Kryo 250 Gold, Cortex-A73 + 1.8 GHz Kryo 250 Silver, Cortex-A53) Adreno 506 725 MHz (69.6 GFLOPS in FP32) Hexagon 546 Up to 40 MP single camera, 13 MP dual camera; Video Capture: 4K@30fps LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 June 26, 2018 Q3 2018
SDM636 Snapdragon

636

 4 + 4 cores (1.8 GHz Kryo 260 Gold, Cortex-A73 + 1.6 GHz Kryo 260 Silver, Cortex-A53) Adreno 509 430 MHz (110.1 GFLOPS in FP32) Hexagon 680 Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 4.0 October 17, 2017 Q4 2017
MSM8956 Snapdragon

650

 28 nm (TSMC 28HPM) 2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) Adreno 510 600 MHz (153.6 GFLOPS in FP32) Hexagon V56 Up to 21 MP single camera; Video Capture: 4K@30fps LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 3.0 February 18, 2015 Q1 2016
MSM8976 Snapdragon

652

 4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)
MSM8976

Pro

 Snapdragon

653

 4 + 4 cores (1.95 GHz Cortex-A72 + 1.4 GHz Cortex-A53) Adreno 510 621 MHz (159 GFLOPS in FP32) X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) October 18, 2016 Q4 2016
SDM660 Snapdragon

660

 14 nm (Samsung 14LPP) 4 + 4 cores (2.2 GHz Kryo 260 Gold, Cortex-A73 + 1.84 GHz Kryo 260 Silver, Cortex-A53) Adreno 512 647 MHz (165.6 GFLOPS in FP32) Hexagon 680 Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 4.0 May 8, 2017 Q2 2017
SDA660 Snapdragon

660

 Internal: no
SM6115 Snapdragon

662

 11 nm (Samsung 11LPP) 4 + 4 cores (2.0 GHz Kryo 260 Gold, Cortex-A73 + 1.8 GHz Kryo 260 Silver, Cortex-A53) Adreno 610 950 MHz (243.2 GFLOPS in FP32) Hexagon 683 Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps) LPDDR3 933 MHz LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C 3.0 January 20, 2020 Q1 2020
SM6125 Snapdragon

665

 Hexagon 686 (3.3 TOPS) Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.1, Wi-Fi 802.11ac, NFC, USB 3.1 April 9, 2019 Q2 2019
SDM670 Snapdragon

670

 10 nm (Samsung 10LPP) 2 + 6 cores (2.0 GHz Kryo 360 Gold, Cortex-A75 + 1.7 GHz Kryo 360 Silver, Cortex-A55) Adreno 615 430 MHz (220.2 GFLOPS in FP32) Hexagon 685 (3 TOPS) Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) Bluetooth 5, 802.11ac Wi-Fi, NFC, USB 3.1 4+ August 8, 2018 Q3 2018
SM6150 Snapdragon

675

 11 nm (Samsung 11LPP) 2 + 6 cores (2.0 GHz Kryo 460 Gold, Cortex-A76 + 1.7 GHz Kryo 460 Silver, Cortex-A55) Adreno 612 845 MHz (216.3 GFLOPS in FP32) Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) October 22, 2018 Q1 2019
SM6150-

AC

 Snapdragon

678

 2 + 6 cores (2.2 GHz Kryo 460 Gold, Cortex-A76 + 1.7 GHz Kryo 460 Silver, Cortex-A55) Adreno 612 895 MHz (229.1 GFLOPS in FP32) December 15, 2020 Q4 2020
SM6225 Snapdragon

680

 6 nm (TSMC N6) 4 + 4 cores (2.4 GHz Kryo 265 Gold, Cortex-A73 + 1.9 GHz Kryo 265 Silver, Cortex-A53) Adreno 610 1114 MHz (285.2 GFLOPS in FP32) Hexagon 686 (3.3 TOPS) Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11ac Wave 2, NFC, NavIC, USB C 3.0 October 26, 2021 Q4 2021
SM6225-

AD

 Snapdragon

685

 4 + 4 cores (2.8 GHz Kryo 265 Gold, Cortex-A73 + 1.9 GHz Kryo 265 Silver, Cortex-A53) Adreno 610 1260 MHz (322.6 GFLOPS in FP32) Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1 March 23, 2023 Q1 2023
SM6350 Snapdragon

690

 8 nm (Samsung 8LPP) 2 + 6 cores (2.0 GHz Kryo 560 Gold, Cortex-A77 + 1.7 GHz Kryo 560 Silver, Cortex-A55) Adreno 619L 565 MHz (289.3 GFLOPS in FP32) Hexagon 692 (5 TOPS) Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, 802.11ac 2x2 (MU-MIMO), NFC, USB 3.1 4+ June 16, 2020 H2 2020
SM6375 Snapdragon

695

 6 nm (TSMC N6) 2 + 6 cores (2.2 GHz Kryo 660 Gold, Cortex-A78 + 1.8 GHz Kryo 660 Silver, Cortex-A55) Adreno 619 840 MHz (430.1 GFLOPS in FP32) Hexagon 686 (3.3 TOPS) Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11ac 2x2 (MU-MIMO), NFC, USB C October 26, 2021 Q4 2021

Snapdragon 6s 4G (since 2024)

The 600 series concluded in 2023 with the 695. The 6s 4G series (2024-) targets cost-sensitive 4G-only markets using recycled architectures on mature nodes. Notable examples include the 6s 4G Gen 1 (rebadged SM6115 (Snapdragon 662) from 2020) and Gen 2 (rebadged SM6225 (Snapdragon 680/685) from 2021).

Model

number

 Product  name Fab CPU
(Cores / Freq)		 GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
SM6115-AC Snapdragon 6s 4G Gen 1 11 nm (Samsung 11LPP) Kryo
4 + 4 cores
(2.1 GHz Cortex-A73
+ 2.0 GHz Cortex-A53)		 Adreno 610 1050 MHz (268.8 GFLOPS in FP32) Hexagon Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps) LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C 3.0 August 9, 2024 Q3 2024
SM6225-AF Snapdragon 6s 4G Gen 2 6 nm (TSMC N6) Kryo
4 + 4 cores
(2.9 GHz Cortex-A73
+ 1.9 GHz Cortex-A53)		 Adreno 610 Hexagon Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1 December 12, 2025 Q4 2025

Snapdragon 6 (since 2022)

Qualcomm adopted generational naming in 2022 with the Snapdragon 6 series. All models feature integrated 5G modems and Wi-Fi 6/6E. The "6s" variants offer reduced specifications at lower price points. The series transitioned from Samsung 4LPX (Gen 1) to TSMC N4P (Gen 4), achieving significant efficiency gains. The Gen 4 introduces Cortex-A720/A520 cores, marking the first departure from A78/A55 combinations in the lineup and bringing architecture parity with the 7- and 8-series designs albeit with smaller cores at lower clock speeds.

Model

number

 Product  name Fab CPU
(Cores / Freq)		 GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
SM6450 Snapdragon 6 Gen 1 4 nm (Samsung 4LPX) Kryo
4 + 4 cores
(2.2 GHz Cortex-A78
+ 1.8 GHz Cortex-A55)		 Adreno 710 676 MHz (346.1 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s) Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 4+ September 6, 2022 Q1 2023
SM6475-AB Snapdragon 6 Gen 3 Kryo
4 + 4 cores (2.4 GHz Cortex-A78
+ 1.8 GHz Cortex-A55)		 Adreno 710 940 MHz (481.3 GFLOPS in FP32)
or
1010 MHz (517.1 GFLOPS in FP32)		 Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5X dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 August 31, 2024 Q3 2024
SM6475Q Kryo
3 + 3 cores (2.4 GHz Cortex-A78
+ 1.8 GHz Cortex-A55)		 , N/a Q2 2026
SM6375-AC Snapdragon 6s Gen 3 6 nm (TSMC N6) Kryo
2 + 6 cores
(2.3 GHz Cortex-A78
+ 2.0 GHz Cortex-A55)		 Adreno 619 900 MHz (460.8 GFLOPS in FP32) Hexagon Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), NavIC, USB C June 6, 2024 Q2 2024
SM6650 Snapdragon 6 Gen 4 4 nm (TSMC N4P) Kryo
(1× 2.3 GHz Cortex-A720
+ 3× 2.2 GHz Cortex-A720
+ 4× 1.8 GHz Cortex-A520)		 Adreno 810 895 MHz (458.2 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 February 12, 2025 Q1 2025
SM6435-AA Snapdragon 6s Gen 4 4 nm (Samsung 4LPX) Kryo
4 + 4 cores (2.4 GHz Cortex-A78
+ 1.8 GHz Cortex-A55)		 Adreno 710 Hexagon Spectra (200 MP Photo Capture / 32 MP single camera with ZSL / 16+16 MP dual camera with ZSL; Video Capture: 2K@30fps HDR) October 24, 2025 Q4 2025
SM6850 Snapdragon 6 Gen 5 4 nm (TSMC N4P) Kryo
4 + 4 cores (2.6 GHz Cortex-A78
+ 2.0 GHz Cortex-A55)		 Adreno 812 Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 16+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) Internal: (5G NR Sub-6: download up to 2.8 Gbit/s) FastConnect; Bluetooth 6.0; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 2.0 5 May 7, 2026 Q2 2026

06Snapdragon 7 series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series (the predecessor of Snapdragon 7 series is Snapdragon 660), and primarily aimed at premium mid-range segment.

Snapdragon 700 series (2018-2022)

Model number Product name Fab CPU (ARMv8.2) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
SDM710 Snapdragon 710 10 nm (Samsung 10LPP) 2 + 6 cores (2.2 GHz Kryo 360 Gold, Cortex-A75 + 1.7 GHz Kryo 360 Silver, Cortex-A55) Adreno 616 504 MHz (258 GFLOPS in FP32) Hexagon 685 (3 TOPS) Spectra 250
(192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)		 LPDDR4X
Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)		 X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0;
NFC; 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s;
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		 4 May 23, 2018 Q2 2018
SDM712 Snapdragon 712 2 + 6 cores (2.3 GHz Kryo 360 Gold, Cortex-A75 + 1.7 GHz Kryo 360 Silver, Cortex-A55) Adreno 616 610 MHz (312.3 GFLOPS in FP32) 4+ February 6, 2019 Q1 2019
SM7125 Snapdragon 720G 8 nm (Samsung 8LPP) 2 + 6 cores (2.3 GHz Kryo 465 Gold, Cortex-A76 + 1.8 GHz Kryo 465 Silver, Cortex-A55) Adreno 618 750 MHz (384 GFLOPS in FP32) Hexagon 692 (5 TOPS) Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) FastConnect 6200;
Bluetooth 5.1; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1		 January 20, 2020 Q1 2020
SM7150-AA Snapdragon 730 2 + 6 cores (2.2 GHz Kryo 470 Gold, Cortex-A76 + 1.8 GHz Kryo 470 Silver, Cortex-A55) Adreno 618 610 MHz (312.3 GFLOPS in FP32) Hexagon 688 (3.6 TOPs) Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) FastConnect 6200;
Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		 April 9, 2019 Q2 2019
SM7150-AB Snapdragon 730G Adreno 618 700 MHz (358.4 GFLOPS in FP32)
SM7150-AC Snapdragon 732G 2 + 6 cores (2.3 GHz Kryo 470 Gold, Cortex-A76 + 1.8 GHz Kryo 470 Silver, Cortex-A55) Adreno 618 800 MHz (409.6 GFLOPS in FP32) FastConnect 6200;
Bluetooth 5.1; NFC; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s;
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		 August 31, 2020 Q3 2020
SM7225 Snapdragon 750G 2 + 6 cores (2.2 GHz Kryo 570 Gold, Cortex-A77 + 1.8 GHz Kryo 570 Silver, Cortex-A55) Adreno 619 800 MHz (409.6 GFLOPS in FP32) Hexagon 694 (4.7 TOPs) Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6200;
Bluetooth 5.1; NFC; 802.11ac/ax-ready 2x2 (MU-MIMO); GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		 September 22, 2020 Q4 2020
SM7250-AA Snapdragon 765 7 nm (Samsung 7LPP) 1x 2.3 GHz Kryo 475 Prime (Cortex-A76) +
1x 2.2 GHz Kryo 475 Gold (Cortex-A76) +
6x 1.8 GHz Kryo 475 Silver (Cortex-A55)		 Adreno 620 540 MHz (414.7 GFLOPS in FP32) Hexagon 696 (5.4 TOPs) Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) FastConnect 6200;
Bluetooth 5.0; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1		 December 4, 2019 Q1 2020
SM7250-AB Snapdragon 765G 1x 2.4 GHz Kryo 475 Prime (Cortex-A76) +
1x 2.2 GHz Kryo 475 Gold (Cortex-A76) +
6x 1.8 GHz Kryo 475 Silver (Cortex-A55)		 Adreno 620 625 MHz (480 GFLOPS in FP32)
SM7250-AC Snapdragon 768G 1x 2.8 GHz Kryo 475 Prime (Cortex-A76) +
1x 2.4 GHz Kryo 475 Gold (Cortex-A76) +
6x 1.8 GHz Kryo 475 Silver (Cortex-A55)		 Adreno 620 750 MHz (576 GFLOPS in FP32) FastConnect 6200; Bluetooth 5.2; NFC; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 May 10, 2020 Q2 2020
SM7325 Snapdragon 778G 6 nm (TSMC N6) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78) +
3x 2.4 GHz Kryo 670 Gold (Cortex-A78) +
4x 1.8 GHz Kryo 670 Silver (Cortex-A55)		 Adreno 642L 550 MHz (563.2 GFLOPS in FP32) Hexagon 770 (12 TOPs) Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;
Bluetooth 5.2;
802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		 May 19, 2021 Q2 2021
SM7325-AE Snapdragon 778G+ 1x 2.5 GHz Kryo 670 Prime (Cortex-A78) +
3x 2.4 GHz Kryo 670 Gold (Cortex-A78) +
4x 1.8 GHz Kryo 670 Silver (Cortex-A55)		 Adreno 642L 608 MHz (622.6 GFLOPS in FP32) October 26, 2021 Q4 2021
SM7350-AB Snapdragon 780G 5 nm (Samsung 5LPE) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78) +
3x 2.2 GHz Kryo 670 Gold (Cortex-A78) +
4x 1.9 GHz Kryo 670 Silver (Cortex-A55)		 Adreno 642 490 MHz (752.6 GFLOPS in FP32) Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X
Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)		 Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6900;
Bluetooth 5.2;
802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		 March 25, 2021 Q1 2021
SM7325-AF Snapdragon 782G 6 nm (TSMC N6) 1x 2.7 GHz Kryo 670 Prime (Cortex-A78) +
3x 2.4 GHz Kryo 670 Gold (Cortex-A78) +
4x 1.8 GHz Kryo 670 Silver (Cortex-A55)		 Adreno 642L 719 MHz (736.3 GFLOPS in FP32) Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5
Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700;
Bluetooth 5.2;
802.11ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		 November 23, 2022 Q4 2022

Snapdragon 7 (since 2022)

Model number Product name Fab Die size CPU
(Cores / Freq)		 GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
SM7450-AB Snapdragon 7 Gen 1 4 nm (Samsung 4LPX) 77.8mm2 Kryo
(1× 2.4 GHz {2.5 GHz Accelerated Edition} Cortex-A710
+ 3× 2.36 GHz Cortex-A710
+ 4× 1.8 GHz Cortex-A510)		 Adreno 644 443 MHz (680.4 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 4+ May 20, 2022 Q2 2022
SM7475-AB Snapdragon 7+ Gen 2 4 nm (TSMC N4) 102.6 mm2 Kryo
(1× 2.91 GHz Cortex-X2
+ 3× 2.49 GHz Cortex-A710
+ 4× 1.8 GHz Cortex-A510)		 Adreno 725 580 MHz (1187.8 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GB/s) FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 5 March 17, 2023 Q1 2023
SM7435-AB Snapdragon 7s Gen 2 4 nm (Samsung 4LPX) Kryo
4 + 4 cores
(2.4 GHz Cortex-A78
+ 1.95 GHz Cortex-A55)		 Adreno 710 940 MHz (481.3 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 4+ September 15, 2023 Q3 2023
SM7550-AB Snapdragon 7 Gen 3 4 nm (TSMC N4P) 55.16 mm2 Kryo
(1× 2.63 GHz Cortex-A715
+ 3× 2.4 GHz Cortex-A715
+ 4× 1.8 GHz Cortex-A510)		 Adreno 720 975 MHz (998.4 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 5 November 17, 2023 Q4 2023
SM7675-AB Snapdragon 7+ Gen 3 89.54 mm2 Kryo
(1× 2.8 GHz Cortex-X4
+ 4× 2.6 GHz Cortex-A720
+ 3× 1.9 GHz Cortex-A520)		 Adreno 732 950 MHz (1459.2 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 March 21, 2024 Q1 2024
SM7635 Snapdragon 7s Gen 3 Kryo
(1× 2.5 GHz Cortex-A720
+ 3× 2.4 GHz Cortex-A720
+ 4× 1.8 GHz Cortex-A520)		 Adreno 810 1050 MHz (537.6 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 4+ August 20, 2024 Q3 2024
SM7750-AB Snapdragon 7 Gen 4 70.35 mm2 Kryo
(1× 2.8 GHz Cortex-A720
+ 4× 2.4 GHz Cortex-A720
+ 3× 1.84 GHz Cortex-A520)		 Adreno 722 1150 MHz (1177.6 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)
or
LPDDR5X dual-channel 16-bit (32-bit) 4200 MHz (33.6 GB/s)		 Internal (5G NR Sub-6: download up to 4.2 Gbit/s) FastConnect 7700; Bluetooth 6.0; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 5 May 15, 2025 Q2 2025
SM7635-AC Snapdragon 7s Gen 4 Kryo
(1× 2.7 GHz Cortex-A720
+ 3× 2.4 GHz Cortex-A720
+ 4× 1.8 GHz Cortex-A520)		 Adreno 810 1150 MHz (588.8 GFLOPS in FP32) Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)
or
LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		 Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 4+ August 19, 2025 Q3 2025

07Snapdragon 8 series

The Snapdragon 8 series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800 series (2013-2021)

Model number Product name Fab Die size CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability
APQ8074AA Snapdragon
800		 28 nm
(TSMC
28HPM)		 118 mm2 4 cores
2.26 GHz
Krait 400; 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache		 Adreno 330
450 MHz
(115.2
GFLOPS
in FP32)		 Hexagon
QDSP6 V5
600 MHz		 21 MP
single camera (Video capture: 4K@30fps)		 LPDDR3
Dual-channel
32-bit 800 MHz
(12.8 GB/s)		 , N/a Bluetooth 4.0
802.11ac
(2.4/5 GHz);
IZat Gen8B		 2.0 January 8, 2013 Q2 2013
MSM8274AA Gobi 3G (UMTS)
MSM8674AA Gobi 3G (CDMA, UMTS)
MSM8974AA Gobi 4G
(LTE Cat 4:
download 150 Mbit/s,
upload 50 Mbit/s
MSM8974AA v3 Snapdragon
801		 Gobi 4G
(LTE Cat 4)		 February 24, 2014 Q3 2014
APQ8074AB v3 4 cores
2.36 GHz
Krait 400		 Adreno 330
578 MHz (150 GFLOPS in FP32)		 LPDDR3
Dual-channel
32-bit
933 MHz
(14.9 GB/s)		 , N/a Q4 2013
MSM8274AB Snapdragon
800		 118 mm2 Gobi 3G (UMTS) January 8, 2013 Q4 2013
MSM8674AB v3 Snapdragon
801		 Gobi 3G (CDMA, UMTS) February 24, 2014 Q2 2013
MSM8974AB v3 Gobi 4G
(LTE Cat 4)		 Q4 2013
MSM8274AC v3 4 cores 2.45 GHz Krait 400 Gobi 3G (UMTS) Q2 2014
MSM8974AC v3 Gobi 4G
(LTE Cat 4)		 Q1 2014
APQ8084 Snapdragon
805		 4 cores 2.7 GHz Krait 450 Adreno 420
600 MHz
(153.6
GFLOPS
in FP32)		 Hexagon V50 800 MHz 55 MP single camera (Video capture: 4K@30fps) LPDDR3
Dual-channel
64-bit
800 MHz
(25.6 GB/s)		 External Bluetooth 4.1
802.11ac
(2.4/5 GHz)
IZat Gen8B		 November 20, 2013 Q1 2014
MSM8992 Snapdragon
808		 20 nm
(TSMC)		 2 + 4 cores
(1.82 GHz Cortex-A57 +
1.44 GHz Cortex-A53)
 Adreno 418
600 MHz

(153.6
GFLOPS
in FP32)		 Hexagon
V56
800 MHz		 Up to 21 MP single camera (Video capture: 4K@30fps) LPDDR3
Dual-channel
32-bit
933 MHz
(14.9 GB/s)		 X10 LTE
(Cat 9:
download
450 Mbit/s, upload
50 Mbit/s)
 Bluetooth 4.1
802.11ac
IZat Gen8C		 April 7, 2014 Q3 2014
MSM8994 v1 Snapdragon
810		 4 + 4 cores
(1.958 GHz Cortex-A57 +
1.555 GHz Cortex-A53)		 Adreno 430
600 MHz
(230.4
GFLOPS
in FP32)		 55 MP
single camera (Video capture: 4K@30fps)		 LPDDR4
Dual-channel
32-bit
1600 MHz
(25.6 GB/s)
MSM8994 v2 Adreno 430
630 MHz
(241.9
GFLOPS
in FP32)		 2015
MSM8994 v2.1 Q2 2015
MSM8996 Lite Snapdragon
820		 14 nm
FinFET
(Samsung
14LPP)		 113.7 mm2
 2 + 2 cores
Kryo
(1.8 GHz +
1.36 GHz)		 Adreno 530
510 MHz
(261.1
GFLOPS
in FP32)		 Hexagon 680
1.0 GHz		 Spectra (28 MP Photo Capture / 25 MP at 30fps single camera with ZSL / 13 MP Dual Camera with ZSL; Video capture: 4K@30fps) LPDDR4
Quad-channel
16-bit (64-bit)
1333 MHz
(21.3 GB/s)		 X12 LTE
(download: Cat 12,
600 Mbit/s;
3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C.
upload: Cat 13,
150 Mbit/s;
2x20 MHz CA; 64-QAM.)		 Bluetooth 4.1
802.11ac
IZat Gen8C		 3.0 March 2, 2015 Q1 2016
MSM8996 2 + 2 cores Kryo
(2.15 GHz + 1.593 GHz)		 Adreno 530 624 MHz
(319.5 GFLOPS in FP32)		 LPDDR4
Quad-channel
16-bit (64-bit)
1866 MHz
(29.8 GB/s)		 Q4 2015
MSM8996 Pro-AB Snapdragon
821		 July 11, 2016 Q3 2016
MSM8996 Pro-AC 2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz) Adreno 530 653 MHz (334.3 GFLOPS in FP32)
MSM8998 Snapdragon
835		 10 nm
FinFET
(Samsung
10LPE)		 72.3 mm2 4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53) Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32) Hexagon 682 Spectra 180 (32 MP Photo capture / 25 MP at 30fps single camera with ZSL / 16 MP Dual Camera with ZSL; Video capture: 4K@30fps) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0;
802.11ac/ad;
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS		 4.0 November 17, 2016 Q2 2017
SDM845 Snapdragon
845		 10 nm
FinFET
(Samsung
10LPP)		 95.0 mm2 4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55) Adreno 630 710 MHz (727 GFLOPS in FP32) Hexagon 685
(3 TOPs)		 Spectra 280 (192 MP Photo capture / 48 MP single camera with MFNR / 32 MP at 30fps single camera with MFNR/ZSL / 16 MP at 60fps single camera with MFNR/ZSL / 16 MP at 30fps Dual Camera with MFNR/ZSL; Video capture: 4K@60fps) X20 LTE
(download: Cat 18,
@ 1200 Mbit/s;
5x20 MHz CA;
256-QAM; 4x4 MIMO on 3C.
upload: Cat 13, @ 150 Mbit/s;
2x20 MHz CA; 64-QAM)		 4+ December 7, 2017 Q1 2018
SM8150 Snapdragon
855		 7 nm
(TSMC
N7)		 76.9 mm2 1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55) Adreno 640 585 MHz (898.6 GFLOPS in FP32) Hexagon 690
(7 TOPs)		 Spectra 380 (192 MP single camera / 48 MP at 30 fps single camera with MFNR/ZSL / 22 MP at 30 fps dual camera with MFNR/ZSL; Video capture: 4K@60fps HDR) LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) +
External: X50 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s)		 Bluetooth 5.0;
802.11ax (Wi-Fi 6);
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS;
USB 3.1		 December 5, 2018 Q1 2019
SM8150-AC Snapdragon
855+		 1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55) Adreno 640 675 MHz (1036.8 GFLOPS in FP32) July 15, 2019 Q3 2019
Snapdragon
860		 March 22, 2021 Q1 2021
SM8150P Snapdragon
855+		 Internal: no +
External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)		 July 15, 2019 Q3 2019
SM8250 Snapdragon
865		 7 nm (TSMC N7P) 86.8 mm2 1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) Adreno 650 587 MHz (901.6 GFLOPS in FP32) Hexagon 698
(15 TOPs)		 Spectra 480 (200 MP Photo Capture / 64 MP at 30 fps single camera with MFNR/ZSL / 25 MP at 30 fps dual camera with MFNR/ZSL; Video capture: 8K@30fps, 4K@120fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or
LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)		 Internal: none +
External: X55 5G (5G NR Sub-6 & mmWave:
download @ 7.5 Gbit/s, upload @ 3 Gbit/s;
LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)		 FastConnect 6800:
Bluetooth 5.1;
802.11ax (Wi-Fi 6)
@ 1.774 Gbit/s;
802.11ad/ay 60 GHz
@ 10 Gbit/s;
GPS, Glonass, NavIC, Beidou, Galileo, QZSS,
SBAS; USB 3.1		 December 4, 2019 Q1 2020
SM8250-AB Snapdragon
865+		 1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) Adreno 650 670 MHz (1029.1 GFLOPS in FP32) FastConnect 6900:
Bluetooth 5.2;
802.11ax (Wi-Fi 6E)
@ 3.6 Gbit/s;
802.11ad/ay 60 GHz
@ 10 Gbit/s;
GPS, Glonass, NavIC,
Beidou, Galileo, QZSS,
SBAS; USB 3.1		 July 8, 2020 Q3 2020
SM8250-AC Snapdragon
870		 1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) FastConnect 6800
Bluetooth 5.2
802.11ax (Wi-Fi 6)
@ 1.774 Gbit/s;
802.11ad/ay 60 GHz
@ 10 Gbit/s;
GPS, Glonass, NavIC,
Beidou, Galileo, QZSS,
SBAS; USB 3.1		 January 19, 2021 Q1 2021
SM8350 Snapdragon
888		 5 nm
(Samsung
5LPE)		 112.2 mm2 1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55) Adreno 660 840 MHz (1290.2 GFLOPS in FP32) Hexagon 780
(26 TOPs)		 Spectra 580 (200 MP Photo Capture; 84 MP single camera @ 30 fps MFNR/ZSL, 64 MP dual camera @ 30fps ZSL, 28 MP triple camera @ 30fps ZSL; Video Capture: 8K@30fps, 4K@120fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal: X60 5G (5G NR Sub-6 & mmWave: download 7.5 Gbit/s, upload 3 Gbit/s; LTE Cat 22: download 2.5 Gbit/s, upload 0.316 Gbit/s) FastConnect 6900:
Bluetooth 5.2
802.11ax (Wi-Fi 6E)
@ 3.6 Gbit/s;
GPS, Glonass, NavIC,
Beidou, Galileo, QZSS;
USB 3.1		 5 December 1, 2020 Q1 2021
SM8350-AC Snapdragon
888+		 1 + 3 + 4 cores
Kryo 680
(3.0 GHz Cortex-X1 +
2.42 GHz Cortex-A78 +
1.80 GHz Cortex-A55)		 Hexagon 780
(32 TOPs)		 June 28, 2021 Q3 2021

Snapdragon 8 (since 2021)

Model number Product name Fab Die size CPU (ARMv9)
(Cores / Freq)		 GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Announcement date Released
SM8450 Snapdragon
8 Gen 1		 4 nm
(Samsung
4LPX)		 128.5 mm2 Kryo
(1× 3.0 GHz Cortex-X2
+ 3× 2.5 GHz Cortex-A710
+ 4× 1.8 GHz Cortex-A510)		 Adreno 730
818 MHz
(1675.3 GFLOPs
in FP32)		 Hexagon Spectra
(200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR)		 LPDDR5 Quad-channel
16-bit (64-bit) 3200 MHz
(51.2 GiB/s)		 Internal:
X65 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s;
LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)		 FastConnect 6900:
Bluetooth 5.3;
802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1		 5 November 30, 2021 Q4 2021
SM8475 Snapdragon
8+ Gen 1		 4 nm
(TSMC
N4)		 102.6 mm2 Adreno 730
900 MHz
(1843.2 GFLOPS
in FP32)		 May 20, 2022 Q4 2022
Kryo
(1× 3.2 GHz Cortex-X2
+ 3× 2.75 GHz Cortex-A710
+ 4× 2.0 GHz Cortex-A510)		 Q2 2022
SM8425 Snapdragon
8+ Gen 1 4G		 Internal:
(LTE Cat 22:
download @ 2.5 Gbit/s,
upload @ 0.316 Gbit/s)		 Q3 2022
SM8550-AB Snapdragon
8 Gen 2		 118.4 mm2 Kryo
(1× 3.19 GHz Cortex-X3
+ 4× 2.8 GHz {2×Cortex-A715, 2×Cortex-A710}
+ 3× 2.0 GHz Cortex-A510)		 Adreno 740
680 MHz
(2089
GFLOPS
in FP32)		 LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) Internal:
X70 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s)		 FastConnect 7800:
Bluetooth 5.3;
802.11ac/ax/be
(Wi-Fi 7) @ 5.8 Gbit/s;
GPS, Glonass, NavIC, Beidou, Galileo, QZSS;
USB 3.1
or
FastConnect 6900:
Bluetooth 5.3;
802.11ac/ax (Wi-Fi 6E) @ 3.6 Gbit/s;
GPS, Glonass, NavIC, Beidou, Galileo, QZSS;
USB 3.1		 November 15, 2022 Q4 2022
SM8550-AC Snapdragon
8 Gen 2 for Galaxy		 Kryo
(1× 3.36 GHz Cortex-X3
+ 4× 2.8 GHz {2×Cortex-A715, 2×Cortex-A710}
+ 3× 2.0 GHz Cortex-A510)		 Adreno 740
719 MHz
(2208.8
GFLOPS
in FP32)		 Q1 2023
SM8650-AB Snapdragon
8 Gen 3		 4 nm
(TSMC
N4P)		 137.3 mm2 Kryo
(1× 3.3 GHz Cortex-X4
+ 3× 3.15 GHz Cortex-A720
+ 2× 2.96 GHz Cortex-A720
+ 2× 2.27 GHz Cortex-A520)		 Adreno 750
903 MHz
(2774
GFLOPS
in FP32)		 LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) Internal: X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s) FastConnect 7800:
Bluetooth 5.4;
802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s;
GPS, Glonass, NavIC, Beidou, Galileo, QZSS; USB 3.1		 October 24, 2023 Q4 2023
SM8650-AA Kryo
(1× 3.05 GHz Cortex-X4
+ 5× 2.96 GHz Cortex-A720
+ 2× 2.04 GHz Cortex-A520)		 Q4 2024
SM8650-Q-AB Kryo
(1× 3.30 GHz Cortex-X4
+ 4× 2.96 GHz Cortex-A720
+ 1× 2.27 GHz Cortex-A520)		 , N/a Q3 2025
SM8650-Q-AA Kryo
(1× 3.05 GHz Cortex-X4
+ 4× 2.96 GHz Cortex-A720
+ 1× 2.04 GHz Cortex-A520)
SM8650-AC Snapdragon
8 Gen 3 for Galaxy		 Kryo
(1× 3.4 GHz Cortex-X4
+ 3× 3.15 GHz Cortex-A720
+ 2× 2.96 GHz Cortex-A720
+ 2× 2.27 GHz Cortex-A520)		 Adreno 750
1000 MHz
(3072
GFLOPS
in FP32)		 Internal: X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s) Q1 2024
SM8635 Snapdragon
8s Gen 3		 89.54 mm2 Kryo
(1× 3.0 GHz Cortex-X4
+ 4× 2.8 GHz Cortex-A720
+ 3× 2.0 GHz Cortex-A520)		 Adreno 735
1100 MHz
(1689.6
GFLOPS
in FP32)		 Spectra

(200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR)

 LPDDR5X quad-channel 16-bit (64-bit)
4200 MHz
(67.2 GB/s)		 Internal: X70 5G (5G NR Sub-6 & mmWave: download @ 6.5 Gbit/s, upload @ 3.5 Gbit/s) March 18, 2024 Q1 2024
SM8750-AB Snapdragon
8 Elite		 3 nm
(TSMC
N3E)		 124.1 mm2 Oryon
(2× 4.32 GHz Prime cores
+ 6× 3.53 GHz Performance cores)		 Adreno 830
1100 MHz
(3379.2
GFLOPS
in FP32)		 Spectra

(320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR)

 LPDDR5X quad-channel
16-bit (64-bit)
5300 MHz
(84.8 GB/s)		 Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) FastConnect 7900:
Bluetooth 6.0,
802.11ax/be
(Wi-Fi 7) @ 5.8 Gbit/s,
GPS, QZSS, Glonass, NavIC, Beidou, Galileo,
USB 3.1		 October 22, 2024 Q4 2024
SM8750-3-AB Oryon
(2× 4.32 GHz Prime cores
+ 5× 3.53 GHz
Performance cores)		 Q1 2025
SM8750-AC Snapdragon
8 Elite for Galaxy		 Oryon
(2× 4.47 GHz Prime cores
+ 6× 3.53 GHz Performance cores)		 Adreno 830
1200 MHz
(3686.4
GFLOPS
in FP32)
SM8735 Snapdragon
8s Gen 4		 4 nm
(TSMC
N4P)		 105.5 mm2 Kryo
(1× 3.21 GHz Cortex-X4
+ 3× 3.0 GHz Cortex-A720
+ 2× 2.8 GHz Cortex-A720
+ 2× 2.02 GHz Cortex-A720)		 Adreno 825
1150 MHz
(2355.2
GFLOPS
in FP32)		 Spectra

(320 MP Photo Capture, 108 MP single camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR)

 LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) Internal (5G NR Sub-6: download up to 4.2 Gbit/s) April 2, 2025 Q2 2025
SM8850-AC Snapdragon
8 Elite Gen 5		 3 nm
(TSMC
N3P)		 126.2 mm2 Oryon
(2× 4.61 GHz Prime cores
+ 6× 3.63 GHz Performance cores)		 Adreno 840
1200 MHz
(3686.4
GFLOPS
in FP32)		 Spectra

(320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 4K@120fps HDR)

 LPDDR5X quad-channel
16-bit (64-bit)
5300 MHz
(84.8 GB/s)		 Internal: X85 5G (5G NR Sub-6 & mmWave: download 12.5 Gbit/s, upload 3.7 Gbit/s) September 24, 2025 Q3 2025
SM8850-5-AC Oryon
(2× 4.61 GHz Prime cores
+ 5× 3.63 GHz Performance cores)		 Q1 2026
SM8850-1-AD Snapdragon
8 Elite Gen 5 for Galaxy		 Oryon
(2× 4.74 GHz Prime cores
+ 6× 3.63 GHz Performance cores)		 Adreno 840
1300 MHz
(3993.6
GFLOPS
in FP32)
SM8850-1-AB Snapdragon
8 Elite Gen 5 V Series		 Oryon
(2× 4.61 GHz Prime cores
+ 6× 3.63 GHz Performance cores)		 Adreno 840 (8 CUs)
1200 MHz
(2457.6
GFLOPS
in FP32)		 Q3 2026
SM8845 Snapdragon
8 Gen 5		 103.5 mm2 Oryon
(2× 3.8 GHz Prime cores
+ 6× 3.32 GHz Performance cores)		 Adreno 829
1225 MHz
(2508.8
GFLOPS
in FP32)		 LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) November 26, 2025 Q4 2025

08Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

Model number Product name Fab CPU (ARMv8) GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Announcement date Sampling
availability
MSM8998 Snapdragon
835		 10 nm
(Samsung
10LPE)		 Kryo 280

(4× 2.6 GHz + 4× 1.9 GHz)

 Adreno 540 710 MHz (363.5 GFLOPS in FP32) Hexagon 682 Spectra 180
(Up to 32 MP camera / 16 MP dual)		 LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5;
802.11ac/ad
Wave 2 (MU-MIMO);
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS		 4 December 5, 2017 Q2 2018
SDM850 Snapdragon
850		 10 nm
(Samsung
10LPP)		 Kryo 385

(4× 2.96 GHz + 4× 1.77 GHz)

 Adreno 630 710 MHz (727 GFLOPS in FP32) Hexagon 685 (3 TOPS) Spectra 280
(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)		 LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ June 4, 2018 Q3 2018

Snapdragon 7c/7c+ Compute Platforms

Model number Product name Fab CPU (ARMv8) GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Announcement date Sampling
availability
SC7180 Snapdragon 7c 8 nm
(Samsung
8LPP)		 Kryo 468
2 + 6 cores
(2.4 GHz)		 Adreno 618 825 MHz
(422.4 GFLOPS
in FP32)		 Hexagon 692
(5 TOPS)		 Spectra 255
(32 MP camera, 16 MP dual)		 LPDDR4X
Dual-channel 16-bit (32-bit)
2133 MHz
(17.1 GB/s)		 X15 LTE
download: Cat 15, @ 800 Mbit/s;
upload: Cat 13, @ 150 Mbit/s		 Bluetooth 5;
802.11ax (Wi-Fi 6);
GPS, Glonass, SBAS, Beidou, Galileo, QZSS, NavIC;
USB 3.1; eMMC 5.1, UFS 3.0		 December 5, 2019 Q1 2020
SC7180P Snapdragon
7c Gen 2		 Kryo 468
2 + 6 cores
(2.55 GHz)		 May 24, 2021 Q2 2021
SC7280 Snapdragon
7c+ Gen 3		 6 nm
(TSMC
N6)		 Kryo 4 Gold +
4 Silver cores
(Cortex-A78 2.4 GHz +
Cortex-A55 1.8 GHz)		 Adreno 642L 700 MHz
(716.8 GFLOPS in FP32)		 Hexagon
(6.5 TOPS)		 Spectra
(64 MP single camera or
36+22 MP dual camera)		 LPDDR4X
Dual-channel 16-bit (32-bit)
2133 MHz (17.1 GB/s) or
LPDDR5
Dual-channel 16-bit (32-bit)
3200 MHz (25.6 GB/s)		 Internal:X53 5G/LTE (5G:
download @ 3.7 Gbit/s,
upload @ 2.9 Gbit/s;
LTE Cat 24/22:
download @ 1200 Mbit/s,
upload @ 210 Mbit/s)		 FastConnect 6700,
Bluetooth 5.2;
802.11ax (Wi-Fi 6E)
2x2 (MU-MIMO) @ 3.6 Gbit/s;
GPS, Glonass, BeiDou, Galileo, QZSS, SBAS,
USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD		 December 1, 2021 Q1 2022

Snapdragon 8c Compute Platforms

Model number Product name Fab CPU (ARMv8) GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Announcement date Sampling
availability
SC8180 Snapdragon 8c 7 nm
(TSMC
N7)		 Kryo 490 4 + 4 cores
(2.45 GHz + 1.80 GHz)		 Adreno 675
590 MHz		 Hexagon 690
(9 TOPS)		 Spectra 390
(192MP single camera or
22MP at 30fps dual camera with MFNR / ZSL)		 LPDDR4X
Quad-channel
16-bit (64-bit)
2133 MHz (34.1 GB/s)		 Internal: X24 LTE
(Cat 20: download @ 2 Gbit/s,
7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C.
upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM)

External: X55 5G/LTE
(5G: download @ 7 Gbit/s, upload @ 3 Gbit/s;
LTE Cat 22:
download @ 2.5 Gbit/s, upload @ 316 Mbit/s)		 Bluetooth 5.0;
802.11ac/ad;
GPS, Glonass, SBAS, Beidou, Galileo, QZSS;
USB 3.1; UFS 3.0, NVMe SSD		 4+ December 5, 2019 Q1 2020

Snapdragon 8cx Compute Platforms

Model number Product name Fab CPU (ARMv8) GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Announcement date Sampling
availability
SC8180X Snapdragon
8cx		 7 nm
(TSMC
N7)		 Kryo 495
4 + 4 cores
(2.84 GHz Cortex-A76
+ 1.80 GHz Cortex-A55)		 Adreno 680
585 MHz
(1797.1
GFLOPS
in FP32)		 Hexagon
690
(9 TOPS)		 Spectra 390
(32MP single camera,
16MP at 30fps dual camera with MFNR / ZSL)		 LPDDR4X
Octa-channel
16-bit (128-bit)
2133 MHz
(68.3 GB/s)		 No internal modem
Optional external X24 LTE (Cat 20:
download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C.
Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM)		 Bluetooth 5.0;
802.11ac/ad;
GPS, Glonass, SBAS, Beidou, Galileo, QZSS;
USB 3.1; UFS 3.0, NVMe SSD		 4+ December 6, 2018 Q3 2019
SC8180XP Snapdragon
8cx Gen 2 5G		 Kryo 495
4 + 4 cores
(3.15 GHz Cortex-A76
+ 1.8 GHz Cortex-A55)		 Adreno 690
660 MHz
(2027.5
GFLOPS
in FP32)		 No internal modem

Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) or
X55 5G/LTE (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)		 Bluetooth 5.1;
802.11ax (Wi-Fi 6)
2x2 (MU-MIMO) @ 2.4 Gbit/s,
NFC, GPS, Glonass, Beidou, Galileo, QZSS, SBAS,
USB 3.1; UFS 3.0. NVMe SSD		 September 3, 2020 Q3 2020
SC8280 Snapdragon
8cx Gen 3
 5 nm
(Samsung
5LPE)		 Kryo
4 + 4 cores
(3.0 GHz Cortex-X1
+ 2.40 GHz Cortex-A78)		 Adreno 695
900 MHz
(3686.4
GFLOPS
in FP32)		 Hexagon
(15 TOPS)		 Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem
Optional external
X55 5G/LTE,
X62 5G/LTE, X65 5G/LTE
(5G: download @ 4.4/7.5/10 Gbit/s, upload @ 3 Gbit/s;
LTE Cat 22:
download @ 2.5 Gbit/s,
upload @ 316 Mbit/s)		 FastConnect 6900,
Bluetooth 5.1;
802.11ax (Wi-Fi 6E)
2x2 (MU-MIMO) @ 3.6 Gbit/s;
GPS, Glonass, BeiDou, Galileo, QZSS, SBAS,
USB 3.1; UFS 3.1, NVMe SSD		 December 1, 2021 Q1 2022

Microsoft SQ compute platforms

Product name Fab CPU (ARMv8) GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Announcement date Sampling
availability
Microsoft SQ1 7 nm
(TSMC
N7)		 Kryo 495 4 + 4 cores

(3 GHz Cortex-A76 + 1.80 GHz Cortex-A55)

 Adreno 685 590 MHz (1812.5 GFLOPs in FP32) Hexagon
690
(9 TOPS)		 Spectra 390 (192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

 LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) No internal modem

Optional
external
X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C.
Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)		 Bluetooth 5.0;
802.11ac/ad;
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS;
USB 3.1; UFS 3.0, NVMe SSD		 4+ October 2, 2019 Q4 2019
Microsoft SQ2 Kryo 495 4 + 4 cores

(3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55)

 Adreno
690
680 MHz
(2089 GFLOPs in FP32)		 October 1, 2020 Q4 2020
Microsoft SQ3 5 nm (Samsung 5LPE) Kryo 4 + 4 cores

(3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)

 Adreno
695
900 MHz
(3686.4 GFLOPS in FP32)		 Hexagon (15 TOPS) Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem

Optional
external
X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22:
download up to 2.5 Gbit/s,
upload up to 316 Mbit/s)		 FastConnect 6900,
Bluetooth 5.1;
802.11ac/ax
(Wi-Fi 6E) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB 3.1; UFS 3.1, NVMe SSD		 Q3 2022

09Snapdragon X series

The Snapdragon X series is a family of Qualcomm systems on chips (SoCs) designed primarily for Windows PCs and related form factors, using Arm-based CPU designs and integrating GPU and on-device AI acceleration in a single platform. The series was introduced with the Snapdragon X Elite in October 2023 and expanded with additional tiers including Snapdragon X Plus in April 2024 and Snapdragon X in January 2025, with the lineup positioned to span premium through more mainstream PC designs.

All Snapdragon X SoCs are started from the UEFI/BIOS firmware, which can be provided by AMI, Insyde or Phoenix, and the Qualcomm UEFI firmware includes the XBL firmware library.

Snapdragon X1 series

The Snapdragon X1 series comprises the first generation of Snapdragon X laptop-focused SoCs, including Snapdragon X Elite (model prefix X1E), Snapdragon X Plus (X1P), and Snapdragon X (X1), which share common platform elements such as Qualcomm's Oryon CPU branding, Adreno integrated graphics, and a Hexagon NPU specified by Qualcomm at up to 45 TOPS for on-device AI workloads across multiple X1 configurations.

Product name Model number Fab Die
size		 CPU (Cores/Freq) GPU DSP/NPU ISP Memory
technology		 Modem (external/optional) Connectivity (external) Announcement date Sampling
availability
Snapdragon X X1-26-100 4 nm
(TSMC N4)		 Oryon 8 core (3.0 GHz) Adreno
X1-45
1250 MHz
(1.7 TFLOPS)		 Hexagon (45 TOPS) Spectra (36 MP single camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 7800,
Bluetooth 5.4;
802.11ac/ax/be
(Wi-Fi 7) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB4;
UFS 4.0, NVMe SSD		 January 6, 2025 Q1 2025
X1-26-101 Adreno
X1-85
625 MHz
(1.7 TFLOPS)		 2026
Snapdragon X Plus
 X1P-42-100 Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz) Adreno
X1-45
1250 MHz
(1.7 TFLOPS)		 April 24, 2024 Q2 2024
X1P-46-100 Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz) Adreno
X1-45
1400 MHz
(2.1 TFLOPS)
X1P-64-100 172.7
mm2		 Oryon 10 core (3.4 GHz) Adreno
X1-85
1250 MHz
(3.8 TFLOPS)		 Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100 Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
Snapdragon X Elite
 X1E-78-100 Oryon 12 core (3.4 GHz) October 24, 2023 Q2 2024
X1E-80-100 Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100 Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz) Adreno
X1-85
1500 MHz
(4.6 TFLOPS)
X1E-00-1DE Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

Snapdragon X2 series

The Snapdragon X2 series is the successor generation to the X1 series for Windows PCs, introduced by Qualcomm in late 2025 with higher-tier Snapdragon X2 Elite and X2 Elite Extreme variants and followed in early 2026 by the Snapdragon X2 Plus tier. Qualcomm's published materials describe the X2 generation as increasing the platform's on-device AI capability to an 80 TOPS Hexagon NPU and scaling CPU configurations up to 18 Oryon-branded cores in the flagship tier, while product announcements and coverage indicate initial device availability in 2026.

Product name Model number Fab Die
size		 CPU (Cores/Freq) GPU DSP/NPU ISP Memory
technology		 Modem (external/optional) Connectivity (external) Announcement date Sampling
availability
Snapdragon X2 Plus X2P-42-100 3 nm
(TSMC N3P+N3X)		 Oryon 6 core (4.04 GHz) Adreno
X2-45
910 MHz		 Hexagon (80 TOPS) Spectra (36 MP single/38 MP dual camera) LPDDR5X-9523 Octa-channel 16-bit (128-bit) @ 4761.5 MHz (152 GB/s) X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 7800,
Bluetooth 5.4;
802.11ac/ax/be
(Wi-Fi 7) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB4;
UFS 4.0, NVMe SSD		 January 5, 2026 Q1 2026
X2P-64-100 Oryon 10 core (4.04 GHz) Adreno
X2-45
1700 MHz
Snapdragon X2 Elite
 X2E-78-100 Oryon 12 core (4.0 GHz) Adreno X2-85 1350 MHz Q1 2026
X2E-80-100 Oryon 12 core (4.0 GHz, single-core boost up to 4.7 GHz, dual-core boost up to 4.4 GHz) Adreno
X2-85
1700 MHz		 September 24, 2025 Q4 2025
X2E-84-100 Oryon 12 core (4.0 GHz, single-core and dual core boost up to 4.7 GHz) Hexagon (85 TOPS) Q1 2026
X2E-88-100 Oryon 18 core (4.0 GHz, single-core and dual-core boost up to 4.7 GHz) Adreno
X2-90
1700 MHz
(6.9 TFLOPS)		 Hexagon (80 TOPS) September 24, 2025 Q4 2025
X2E-90-100 Oryon 18 core (4.0 GHz, single-core and dual-core boost up to 5.0 GHz) Hexagon (85 TOPS) Q1 2026
Snapdragon X2 Elite Extreme
 X2E-94-100 Oryon 18 core (4.4 GHz, single-core and dual-core boost up to 4.7 GHz) Adreno
X2-90
1850 MHz
(7.5 TFLOPS)		 Hexagon (80 TOPS) LPDDR5X-9523 Dodeca-channel 16-bit (192-bit) @ 4761.5 MHz (228 GB/s)
X2E-96-100 Oryon 18 core (4.4 GHz, single-core and dual-core boost up to 5.0 GHz) September 24, 2025 Q4 2025

10Wearable platforms

Model number Product name Fab CPU Co-processor GPU DSP/NPU Memory technology Modem Connectivity Announcement date Sampling availability
? Wear 1100 28 nm 1 core up to 1.2 GHz Cortex-A7 (ARMv7) , N/a Fixed Function GPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou May 30, 2016 Q2 2016
Wear 1200 1 core up to 1.3 GHz Cortex-A7 (ARMv7) Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou June 27, 2017 Q2 2017
MSM8909w Wear 2100 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) Adreno 304 Hexagon LPDDR3 400 MHz X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou February 10, 2016 Q1 2016
Wear 2500 June 26, 2018 Q2 2018
Wear 3100 QCC1110 (1 core 50 MHz Cortex-M0) September 10, 2018 Q3 2018
SDM429w Wear 4100 12 nm 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) , N/a Adreno 504 320 MHz Hexagon QDSP6 V56 LPDDR3 Single-channel
32-bit 750 MHz
(6.0 GiB/s)		 Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou June 30, 2020 Q2 2020
Wear 4100+ 12 nm + 28 nm QCC1110 (1 core 50 MHz Cortex-M0)
SW5100 W5 Gen 1 4 nm 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) , N/a Adreno A702 1 GHz Hexagon DSP V66K LPDDR4 Single-channel
16-bit 2133 MHz
(8.5 GiB/s)		 Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) July 19, 2022 Q3 2022
W5+ Gen 1 4 nm + 22 nm QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou
W5/W5+ Gen 2 W5 Gen 2 4 nm , N/a Integrated 2G/3G/LTE (Release 17 w/Category 1bix) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou, NB-NTN August 20, 2025 -
W5+ Gen 2 4 nm + 22 nm QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55)
SW6100
SW6100P		 Snapdragon Wear Elite 3 nm 1× Cortex-A78 up to 2.1 GHz + 4× Cortex-A55 up to 1.95 GHz (ARMv8-A) 500 MHz Adreno A622 Hexagon
(12 TOPS)		 LPDDR5 Single-channel
16-bit 3200 MHz
(12.8 GiB/s)		 5G RedCap Rel-17; LTE TDD/FDD; 3G/WCDMA; NB-NTN Bluetooth 5.3/6.0; Wi-Fi 6 (802.11ax, 2.4/5/6 GHz, 1×1); UWB; GNSS (L1/L5); NFC; GPS; GLONASS, Galileo, BeiDou, NB-NTN, NavIC, QZSS March 2, 2026 ,

11Automotive platforms

The Snapdragon 602A, for application in the motor industry, was announced on January 6, 2014.
The Snapdragon 820A was announced on January 6, 2016.

Snapdragon Automotive Cockpit platform
  • SA4150P
  • SA4155P
  • SA6145P
  • SA6150P
  • SA6155
  • SA6155P •
  • SA7255P
  • SA8145P
  • SA8150P
  • SA8155
  • SA8155P •
  • SA8195P •
  • SA8255P •
  • SA8295P •
Snapdragon Ride & Ride Flex platform
  • SA8540P
  • SA8620P
  • SA8650P
  • SA8770P
  • SA8775P
  • SA9000P • AI Accelerator
Snapdragon Cockpit Elite
  • Snapdragon Digital Chassis
Snapdragon Ride Elite
  • Qualcomm Oryon CPU
Product name
(Model number)		 Fab CPU (Core / Freq) GPU DSP Memory
technology		 Modem Connectivity Sampling
availability
Snapdragon
602A
(APQ8064-AU)		 28 nm
(TSMC 28LP)		 Krait 300
4 cores
1.51 GHz
(ARMv7)		 Adreno 320
400 MHz
(76.8 GFLOPs)
(2048x1536 + 1080p
external display)		 Hexagon
QDSP6 V4
500 MHz		 LPDDR3
Dual-channel 32-bit
533 MHz (8.5 GB/s)		 External: Gobi MDM9615
  • LTE: FDD/TDD Cat3
  • CDMA: EV-DOrB/rA 1x
  • UMTS: TD-SCDMA,
    DC-HSPA+/HSPA
  • GSM: EDGE/GPRS
 Bluetooth 4.1 + BLE
Qualcomm VIVE
QCA6574
802.11ac (Wi-Fi 5)
2x2 (MU-MIMO)		 Q1 2014
Snapdragon
820AM
(APQ8096AU/
MSM8996AU)		 14 nm
(Samsung 14LPP)		 Kryo 2 + 2 cores
(2.15 GHz Gold +
1.59 GHz Silver)
(ARMv8)		 Adreno 530
624 MHz
(319.4 GFLOPs)		 Hexagon 680
1.0 GHz		 LPDDR4X
Dual-channel 32-bit (64-bit)
1866 MHz (29.9 GB/s)		 Internal: APQ: no
MSM: X12 LTE
  • Download: Cat 12,
    600 Mbit/s
  • Upload: Cat 13,
    150 Mbit/s
 Bluetooth 4.1
802.11ac (Wi-Fi 5)
IZat Gen8C		 Q1 2016
SA6155P 11 nm
(Samsung 11LPP)		 Kryo 460
2 + 6 cores
(2.0 GHz Gold +
1.6 GHz Silver)		 Adreno 608/612
430 MHz
(110 GFLOPs)		 Hexagon 685
V6 DSP,
Spectra 230 ISP		 LPDDR4X
Dual-channel 16-bit (32-bit)
2133 MHz (17.0 GB/s)		 Internal:
no		 Bluetooth 5.0
802.11ac (Wi-Fi 5)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS		 Q1 2019
Snapdragon
855A
(SA8155P)		 7 nm
(TSMC N7)		 Kryo 485
1 + 3 + 4 cores
(2.96 GHz Prime
+ 2.42 GHz Gold
+ 1.79 GHz Silver)		 Adreno 640
675 MHz
(1036.8 GFLOPs)		 Hexagon 690
(10 TOPS)		 LPDDR4X
Quad-channel 16-bit (64-bit)
2133 MHz (34.1 GB/s)		 X24 LTE Modem
  • FDD·TDD Cat.20
  • 2Gbps/316Mbps
    7·3CA / VoLTE,
  • 3G GSM, CDMA
    2000, TD-SCDMA,
  • 2G GSM/CDMA
 Bluetooth 5.0
802.11ax (Wi-Fi 6)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS		 Q1 2021
SA8195P Kryo 495
4 + 4 cores
(Cortex-A76 +
Cortex-A55)		 Adreno 680
600 MHz
(1843.2 GFLOPs)		 Hexagon Internal:
no		 Bluetooth 5.0
802.11ax (Wi-Fi 6)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
SA8255P 5 nm
(Samsung 5LPE)		 Kryo 4 + 4 cores
(2.35 GHz Prime
+ 2.35 GHz Gold)		 Adreno 663 Hexagon LPDDR5
Hexa-channel 16-bit (96-bit)
3200 MHz (76.8 GB/s)		 Bluetooth 5.2
802.11ax (Wi-Fi 6)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
SA8295P Kryo 695
4 + 4 cores
(2.56 GHz Cortex-X1 +
2.05 GHz Cortex-A78)		 Adreno 695 Hexagon
(30 TOPS)		 LPDDR4X
Octa-channel 16-bit (128-bit)
2133 MHz (68.2 GB/s)		 Bluetooth 5.2
802.11ax (Wi-Fi 6)
2x2 (MU-MIMO)
@ 1.7 Gbit/s
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS		 2023

12Embedded platforms

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.

Product name
(Model number)		 Fab CPU
(Cores/Freq)		 GPU DSP ISP Memory
technology		 Modem Connectivity Sampling
availability
Snapdragon
410E
(APQ8016E)		 28 nm
(TSMC
28LP)		 4 cores up to 1.2 GHz
Cortex-A53
(ARMv8)		 Adreno 306 Hexagon
QDSP6 V5
691 MHz		 Up to 13 MP camera LPDDR2/3
Single-channel
32-bit 533 MHz
(4.2 GB/s)		 none Bluetooth 4.0,
802.11n, GPS
Snapdragon
600E
(APQ8064E)		 4 cores up to 1.5 GHz
Krait 300
(ARMv7)		 Adreno 320
400 MHz		 Hexagon QDSP6 V4 500 MHz Up to
21 MP
camera		 DDR3/DDR3L
Dual-channel
533 MHz		 Bluetooth 4.0,
802.11a/b/g/n/ac
(2.4/5 GHz),
IZat Gen8A
Snapdragon
800E
(APQ8074)		 28 nm
(TSMC
28HPM)		 4 cores up to 2.3 GHz
Krait 400
(ARMv7)		 Adreno 330 Hexagon
QDSP6 V5		 Up to
55 MP
camera		 LPDDR3
Dual-channel
32-bit
800 MHz
(12.8 GB/s)		 Bluetooth 4.1;
802.11n/ac
(2.4/5 GHz);
IZat Gen8B; NFC,
Gigabit Ethernet,
HDMI,
DisplayPort,
SATA, SDIO,
UART, I2C,
GPIOs, JTAG;
USB 3.0/2.0
Snapdragon
810E
(APQ8094)		 20 nm
(TSMC
20SoC)		 4 + 4 cores
2.0 GHz
Cortex-A57
+ 1.55 GHz
Cortex-A53
(ARMv8)		 Adreno 430
650 MHz		 Hexagon
V56
800 MHz		 Up to
55 MP
camera		 LPDDR4
Dual-channel
32-bit
1600 MHz
(25.6 GB/s)		 Bluetooth 4.1;
802.11ac;
IZat Gen8C
Snapdragon
820E
(APQ8096)		 14 nm
FinFET
(Samsung
14LPP)		 2 + 2 cores
(2.15 GHz + 1.6 GHz)
Kryo
(ARMv8)		 Adreno 530 Hexagon
680
825 MHz		 Up to
28 MP
camera		 LPDDR4
Quad-channel
16-bit (64-bit)
1866 MHz
(29.8 GB/s)		 Bluetooth 4.1;
802.11ac/ad;
IZat Gen8C

13Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform was announced on April 11, 2018. The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory
technology		 Modem Connectivity Quick
Charge		 Sampling
availability
QCS603 10 nm (Samsung 10LPP) 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) Adreno 615 (Quad HD + 4K Ultra HD external display) Hexagon 685 Spectra 270 (Up to 24 MP camera / 16 MP dual) LPDDR4X 16-bit 1866 MHz none Bluetooth 5.0, NFC, 802.11ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+
QCS605 8 cores up to 2.5 GHz Kryo 300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0, NFC, 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

14Home Hub and Smart Audio platforms

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017) was announced on June 14, 2017.
The Qualcomm 212 Home Hub (APQ8009) and Qualcomm 624 Home Hub (APQ8053) were announced on January 9, 2018.

The QCS400 Series was announced March 19, 2019.

Model number Fab CPU (Cores/Freq) GPU DSP ISP Audio Memory
technology		 Modem Connectivity Sampling
availability
APQ8009
(SDA212)		 28 nm (TSMC 28LP) 4 cores up to 1.3 GHz
Cortex-A7 (ARMv7)		 Adreno 304 (HD) Hexagon 536 Up to 16 MP camera LPDDR2/3 Single-channel 533 MHz none Bluetooth 4.2 + BLE, 802.11ac (2.4/5 GHz) Wi-Fi
APQ8017 4 cores up to 1.4 GHz
Cortex-A53 (ARMv8)		 Adreno 308 (Full HD) LPDDR3 Single-channel 667 MHz
APQ8053
(SDA624)		 14 nm (Samsung 14LPP) 8 cores up to 1.8 GHz
Cortex-A53 (ARMv8)		 Adreno 506 (Full HD+) Hexagon 546 Up to 24 MP camera, 13 MP dual LPDDR3
QCS403 Dual-core CPU none 2x Hexagon V66 12× audio channels supported Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 Q1 2019
QCS404 Quad-core CPU
QCS405 Adreno 306 (Full HD+)
QCS407 32× audio channels supported

15Mixed Reality (MR) platforms

Snapdragon XR series

It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
  • Snapdragon XR2+ Gen 1 was announced on October 11, 2022, and is used in the Meta Quest Pro.
  • Snapdragon XR2 Gen 2 is announced in September 2023. Qualcomm claims improved performance compared to its predecessor XR2 5G.
The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.
It supports Wi-Fi 7 network. It is integrated into Meta Quest 3 and Pico 4 Ultra.
Product name Fab Die
size		 CPU (ARMv8) GPU DSP ISP Memory
technology		 Tracking Connectivity Sampling
availability
XR1 10 nm
(Samsung
10LPP)		 4x Kryo 385 Gold +
4x Kryo 385 Silver		 Adreno 615 Hexagon 685 Spectra LPDDR4X
Quad-channel 16-bit (64-bit)		 3DoF and 6DoF
head and controller tracking		 Wi-Fi 5
Bluetooth 5		 Q1 2019
XR2 7 nm
(TSMC
N7+)		 1x Kryo 585 Prime (2.84 GHz) +
3x Kryo 585 Gold (2.42 GHz) +
4x Kryo 585 Silver (1.80 GHz)		 Adreno 650
(up to 2x 3K displays
at 90 Hz)		 Hexagon 698 Spectra
(input from
up to 7 cameras)		 Full 6DoF head and controller tracking,
as well as hand and finger tracking		 Wi-Fi 6
Bluetooth 5
5G		 Q1 2020
XR2+ Gen 1 LPDDR5
Quad-channel 16-bit (64-bit)		 Wi-Fi 6E
Bluetooth 5.2
5G		 Q4 2022
XR2 Gen 2 4 nm
(Samsung
4LPX)		 115.8 mm2 4x Kryo (Cortex-A78C 2.36 GHz) +
2x Kryo (Cortex-A78C 2.05 GHz)		 Adreno 740
(up to 2x 3K displays
at 90 Hz)		 Hexagon Spectra
(input from
up to 10 cameras)		 LPDDR5X
Quad-channel 16-bit (64-bit)		 Wi-Fi 7
Bluetooth 5.3
5G		 Q4 2023
XR2+ Gen 2 4x Kryo (Cortex-A78C) +
2x Kryo (Cortex-A78C)		 Adreno 740
(up to 2x 4.3K displays
at 90 Hz)		 Hexagon Spectra
(input from
up to 12 cameras)		 Q1 2024
Reality Elite 2x Kryo +
4x Kryo		 Adreno
(up to 2x 4.4K displays
at 90 Hz)		 Hexagon
(48 TOPs)		 Wi-Fi 7
Bluetooth 6.0
5G		 Q2 2026

Snapdragon AR series

The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022. It is intended for use in smart glasses.
On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses. It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

16Gaming platforms

Snapdragon G series

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform. The Razer Edge is the first device to use the platform.

The G3x Gen 1 is based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters with higher clock speeds, and the same GPU with a higher clock speed. Connectivity options also seem in line.

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.

On March 19, 2025, Qualcomm revealed the Snapdragon G3 Gen 3, G2 Gen 2, and G1 Gen 2 platforms.

Product name Fab CPU (Cores/Freq) GPU Modem Connectivity Display Sampling
availability
G1 Gen 1 Unknown Kryo (8 core) Adreno A11 , N/a Bluetooth 5.0;
802.11a/b/g/n/ac (Wi-Fi 5)
1x1		 HD at
60 fps		 Q4 2023
G1 Gen 2 4 nm
(Samsung 4LPX)		 2 + 6 cores
(2x 2.4 GHz Kryo Gold, Cortex-A78
+ 6x 1.96 GHz Kryo Silver, Cortex-A55)		 Adreno A12 1010 MHz
(258.6 GFLOPS in FP32)		 X61 5G
(5G NR Sub-6 & mmWave:
download up to 2.5 Gbit/s,
upload up to 900 Mbit/s)		 Bluetooth 5.1;
802.11a/b/g/n/ac (Wi-Fi 5)
1x1		 FHD+ up to
120 fps		 Q1 2025
G2 Gen 1 Kryo
4 + 4 cores
(Cortex-A78
+ Cortex-A55)		 Adreno A21 X62 5G/LTE
(5G NR Sub-6 & mmWave:
download up to 4.4 Gbit/s,
upload up to 1.6 Gbit/s)		 FastConnect 6700;
Bluetooth 5.0;
802.11a/b/g/n/ac/ax (Wi-Fi 6E)
2x2 (MU-MIMO)
up to 2.9 Gbit/s;		 FHD+ up to
144 fps		 Q4 2023
G2 Gen 2 4 nm
(TSMC N4P)		 Kryo
(Cortex-X4
+ 4× Cortex-A720
+ 3× Cortex-A520)		 Adreno A22 X61 5G
(5G NR Sub-6 & mmWave:
download up to 2.5 Gbit/s,
upload up to 900 Mbit/s)		 FastConnect 7800;
Bluetooth 5.3;
802.11a/b/g/n/ac/ax/be (Wi-Fi 7)
up to 5.8 Gbit/s		 QHD+ up to
144 fps		 Q1 2025
G3x Gen 1 5 nm
(Samsung 5LPE)		 1x 3.0 GHz
Kryo 680 Prime (Cortex-X1) +
3x 2.42 GHz
Kryo 680 Gold (Cortex-A78) +
4x 1.80 GHz
Kryo 680 Silver Cortex-A55)		 Adreno 660 900 MHz
(1382.4 GFLOPs in FP32)		 X60 5G
(5G NR Sub-6 & mmWave:
download up to 7.5 Gbit/s,
upload up to 3 Gbit/s;
LTE Cat 22:
download up to 2.5 Gbit/s,
upload up to 0.316 Gbit/s)		 FastConnect 6900;
Bluetooth 5.2;
802.11a/b/g/n/ac/ax (Wi-Fi 6E)
up to 3.6 Gbit/s		 FHD+ up to
144 fps		 Q1 2023
G3x Gen 2 4 nm
(TSMC N4)		 1× 3.36 GHz
Kryo Prime (Cortex-X3)
+ 4× 2.8 GHz
Kryo Gold (2× Cortex-A715
2× Cortex-A710)
+ 3× 2.02 GHz
Kryo Silver (Cortex-A510)		 Adreno A32 1000 MHz
(3072 GFLOPS in FP32)		 X70 5G
(5G NR Sub-6 & mmWave:
download up to 10 Gbit/s,
upload up to 3.5 Gbit/s)		 FastConnect 7800;
Bluetooth 5.3;
802.11a/b/g/n/ac/ax/be (Wi-Fi 7)
up to 5.8 Gbit/s		 Q4 2023
G3 Gen 3 4 nm
(TSMC N4P)		 Kryo
(1× 3.3 GHz Cortex-X4
+ 3× 3.15 GHz Cortex-A720
+ 2× 2.96 GHz Cortex-A720
+ 2× 2.27 GHz Cortex-A520)		 Adreno A33 X61 5G
(5G NR Sub-6 & mmWave:
download up to 2.5 Gbit/s,
upload up to 900 Mbit/s)		 QHD+ up to
144 fps		 Q1 2025

17Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair. Qualcomm announced the QCC5100 Series at CES 2018.

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG. On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series. On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.

Qualcomm QCC300x Series Bluetooth audio SoCs

Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Sampling availability
QCC3001 RISC application processor

(Up to 80 MHz)

 Single core Qualcomm Kalimba DSP (Up to 80 MHz) Bluetooth 5.0

Dual-mode Bluetooth

 TrueWireless Stereo

cVc audio

 Mono / 2-mic
QCC3002 TrueWireless Stereo

aptX Classic/HD/LL

cVc audio
QCC3003 cVc audio Stereo / 1-mic
QCC3004 Stereo / 2-mic
QCC3005 aptX Classic/HD/LL

cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs

Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Digital assistant activation Sampling availability
QCC3020 Dual core 32-bit application processor

(Up to 80 MHz)

 Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

 Bluetooth 5.0

Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

 aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

 ~6mA (2DP streaming) Mono / 2-mic Button press H1 2017
QCC3021 Stereo / 1-mic
QCC3024 cVc audio

Google Fast Pair

 Stereo / 2-mic
QCC3026 aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

 Mono / 2-mic
QCC3031 aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

 Stereo / 1-mic
QCC3034 aptX Classic/HD/LL

cVc audio

Google Fast Pair

 Mono / 2-mic
QCC3040 Dual core 32-bit application processor

(Up to 80 MHz)

 Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

 Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth speed: 2 Mbit/s

 aptX Classic/HD

TrueWireless mirroring

ANC (Feedforward/feedback and hybrid)

cVc audio

Google Fast Pair

 <5 mA Stereo / 2-mic Button press H1 2020
QCC3046 <5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs

Model number Fab CPU DSP Bluetooth Technologies support Power consumption Digital assistant activation Sampling availability
QCC5120 Dual core 32-bit application processor

(Up to 80 MHz)

 Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

 Bluetooth 5.0

Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

 aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback and Hybrid)

cVc audio

Google Fast Pair

 ~6mA (2DP streaming)

~7mA HFP Narrow Band, 1 Digital MIC cVc

 Button press

Qualcomm Voice Activation

 H1 2018
QCC5121
QCC5124
QCC5125 Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

 aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

 ~10mA (2DP streaming)

~10mA HFP Narrow Band, 1 Digital MIC cVc

 Button press
QCC5141 Dual core 32-bit application processor

(Up to 80 MHz)

 Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

 Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Speed: 2 Mbit/s

 aptX Adaptive

eXtension program

TrueWireless Mirroring

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

 ~5mA A2DP stream Button press

Qualcomm Voice Activation

 H1 2020
QCC5144
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